 |
Prototypes,
24, 48 and 72 hour turnaround
|
 |
Multi-layer
up to 20 layers, double and single layer
|
 |
FR4,
Polymide, B-T, High Tg, PTFE and other substrates
|
 |
Hot-air
solder levelling or total surface gold
|
 |
Choice
of photo-imageable solder resists
|
 |
Conductive
ink application
|
 |
Pallette
Routing (Profiling) / scoring
|
 |
Pre-production,
volume quantities
|
 |
Impedance
- controlled constructions
|
 |
UL94VO
File#E105549 including direct support
|
 |
Electrical
testing done to net-list
|
 |
Blind
and / or buried vias
|